Samsung at the Crossroads: An Analysis of Global Fabrication, Quantum Ambitions, and the Evolving Alliance Landscape

Samsung’s Global Manufacturing Footprint: A Strategic Asset Analysis

Samsung Electronics’ position as a titan of the global semiconductor industry is built upon a vast and strategically diversified manufacturing infrastructure. The company’s network of fabrication plants, or “fabs,” is not merely a collection of production sites but a carefully architected system designed for innovation, high-volume manufacturing (HVM), and geopolitical resilience. An analysis of this physical footprint reveals a clear strategy: a core of cutting-edge innovation and mass production in South Korea, a significant and growing presence in the United States for customer proximity and supply chain security, and a carefully managed operation in China focused on specific market segments.

1.1 The South Korean Triad: The Heart of Innovation and Mass Production

The nerve center of Samsung’s semiconductor empire is a dense cluster of facilities located south of Seoul, South Korea. This “innovation triad,” as the company describes it, comprises three world-class fabs in Giheung, Hwaseong, and Pyeongtaek, all situated within an approximately 18-mile radius. This deliberate geographic concentration is a cornerstone of Samsung’s competitive strategy, designed to foster rapid knowledge sharing and streamlined logistics between research, development, and mass production.  

  • Giheung: The historical foundation of Samsung’s semiconductor business, the Giheung fab was established in 1983. Located at 1, Samsung-ro, Giheung-gu, Yongin-si, Gyeonggi-do, this facility has been instrumental in the company’s rise, specializing in a wide range of mainstream process nodes from 350nm down to 8nm solutions. It represents the company’s deep institutional knowledge in mature and specialized manufacturing processes.  
  • Hwaseong: Founded in 2000, the Hwaseong site, at 1, Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, marks Samsung’s push to the leading edge of technology. This facility is a critical hub for both research and development (R&D) and production, particularly for advanced logic processes. It is here that Samsung has implemented breakthrough technologies like Extreme Ultraviolet (EUV) lithography to produce chips on nodes ranging from 10nm down to 3nm, which power the world’s most advanced electronic devices.  
  • Pyeongtaek: The newest and most advanced member of the triad, the Pyeongtaek fab is a state-of-the-art mega-facility dedicated to the mass production of Samsung’s most advanced nodes. Located at 114, Samsung-ro, Godeok-myun, Pyeongtaek-si, Gyeonggi-do, this site is where Samsung pushes the boundaries of Moore’s Law, scaling up the innovations developed in Hwaseong for global supply.  

Beyond this core logic triad, Samsung also operates a facility in Onyang, located in Asan-si, which is focused on crucial back-end processes such as assembly and packaging.  

The strategic co-location of these facilities creates a powerful feedback loop. The semiconductor industry’s most significant challenge is the difficult and capital-intensive transition of a new process node from the R&D lab to reliable high-volume manufacturing. By placing its primary R&D center (Hwaseong) in close physical proximity to its HVM powerhouse (Pyeongtaek) and its hub of legacy process expertise (Giheung), Samsung creates a high-density innovation cluster. This allows for the rapid, in-person collaboration of scientists, engineers, and manufacturing experts to troubleshoot the complex yield and performance issues inherent in cutting-edge fabrication, significantly reducing development cycles and accelerating time-to-market—a critical advantage in its fierce competition with global rivals.

1.2 The American Expansion: Geopolitical Hedging and Customer Proximity

Recognizing the strategic risks of geographic over-concentration, Samsung has made substantial investments in the United States, establishing a second major manufacturing hub. This American expansion is a multi-faceted strategy aimed at mitigating geopolitical risks, moving production closer to key customers, and capitalizing on favorable government policies.

Samsung’s U.S. presence is centered in Texas, with a long-standing fab in Austin and a massive new facility under development in Taylor. This expansion is part of a broader “reshoring” trend in the semiconductor industry, with a total of 17 new fabs planned or under construction in the U.S. by various companies, many focused on the advanced 4nm and 5nm nodes that Samsung is targeting. This trend is a direct response to growing concerns about the long-term viability of supply chains heavily reliant on East Asia, particularly given the political uncertainty surrounding Taiwan, the world’s hub for advanced chipmaking.  

A primary catalyst for Samsung’s deepened U.S. investment is a significant new partnership with Apple. As part of Apple’s $600 billion American Manufacturing Program, the two companies are collaborating to bring a “never been used before anywhere in the world” chip technology to the Austin, Texas facility. This innovative technology is for the production of advanced three-layer stacked CMOS Image Sensors (CIS) intended for future Apple products, specifically targeting the iPhone 18 lineup. This move allows Apple to diversify its sensor supply chain away from its current primary supplier, Sony, while also aligning with U.S. political pressure to increase domestic manufacturing. For Samsung, it secures a high-volume, high-margin contract that validates its technological leadership in a critical component category and helps it avoid potential U.S. tariffs on imported semiconductors.  

Therefore, Samsung’s Texas expansion is far more than a simple capacity increase. It is a sophisticated strategic maneuver that functions as a geopolitical hedge against potential instability in Asia, solidifies its relationship with a crucial and demanding customer by meeting its domestic manufacturing goals, and positions the company to benefit from significant U.S. government incentives designed to bolster the domestic semiconductor ecosystem. The Texas fabs represent a nexus of Samsung’s commercial, political, and supply chain strategies.

1.3 Operations in China: Navigating a Complex Landscape

Samsung maintains a significant, albeit strategically distinct, manufacturing presence in China. These operations are carefully calibrated to serve the vast Chinese market while navigating the increasingly complex and tense geopolitical landscape between the U.S. and China.

The company’s Chinese facilities include a major fabrication plant in Xi’an, a site in Suzhou, and another in Tianjin. The Xi’an facility is one of the world’s largest production centers for NAND flash memory, a critical component for smartphones, servers, and consumer electronics. The Suzhou facility is focused on back-end semiconductor assembly and testing, while the Tianjin site specializes in the production of LEDs.  

This operational structure reveals a deliberate technological demarcation. While Samsung’s South Korean fabs produce the company’s most advanced, “crown jewel” logic chips (3nm, 5nm, etc.), its Chinese operations are focused on memory—a global commodity where Samsung is the undisputed market leader—and less technologically sensitive back-end processes and components. This strategic ring-fencing allows Samsung to maintain a robust presence in the critical Chinese market and benefit from its scale, while simultaneously minimizing the exposure of its most advanced and proprietary foundry technology to the risks associated with the ongoing U.S.-China tech rivalry, which has included U.S. entity lists and Chinese bans on foreign technology firms. It is a calculated approach to profit from China’s market without compromising the core intellectual property that underpins its global competitive advantage.  

Table 1: Samsung’s Global Semiconductor Fabrication and Research Sites

CountryCity/RegionSite Name/DesignationPrimary Function/Technology
South KoreaGiheungSamsung Korea SemiconductorMainstream Logic Fabrication (350nm to 8nm)
HwaseongSamsung Korea SemiconductorAdvanced Logic R&D & Production (10nm to 3nm, EUV)
PyeongtaekSamsung Korea SemiconductorAdvanced Logic High-Volume Manufacturing (<3nm nodes)
OnyangSamsung Korea SemiconductorBack-end Assembly & Packaging
United StatesAustin, TexasSamsung Austin SemiconductorAdvanced Logic, Advanced CMOS Image Sensors (CIS)
Taylor, TexasSamsung Taylor SemiconductorAdvanced Logic Fabrication (planned for 4nm/5nm nodes)
ChinaXi’anSamsung China SemiconductorNAND Flash Memory Fabrication
SuzhouSamsung Electronics Suzhou SemiconductorBack-end Assembly & Testing
TianjinTianjin Samsung LEDLED Production

Navigating the Quantum Frontier: Samsung’s Multi-Faceted Strategy

The advent of quantum computing represents a paradigm shift with the potential to disrupt industries from medicine to finance, while also posing an existential threat to current data security standards. In response, Samsung has adopted a sophisticated and multi-faceted quantum strategy. Rather than making a direct, high-risk leap into the commercial fabrication of quantum computers, the company is pursuing a calculated approach centered on three pillars: developing defensive technologies to protect against quantum threats, enabling quantum-adjacent features in consumer products for market testing, and making strategic investments in foundational research to build long-term capabilities. This analysis confirms that Samsung is not currently engaged in the commercial fabrication of quantum hardware; its focus is on building expertise and monetizing the quantum-era transition through security and strategic positioning.

2.1 Defensive Posture: Post-Quantum Cryptography (PQC)

A significant portion of Samsung’s quantum-related activity is focused on defense. The company recognizes that the immense computational power of future quantum computers, expected to become commercially viable after 2030, will render current public-key encryption algorithms obsolete. This creates a vulnerability to “Harvest now, decrypt later” (HNDL) attacks, where malicious actors steal encrypted data today with the intent of decrypting it once powerful quantum computers are available.  

To counter this threat, Samsung’s System LSI division has developed the S3SSE2A, the industry’s first security chip with hardware-accelerated Post-Quantum Cryptography (PQC). This chip is not a quantum computer itself, but a classical security element designed to be resistant to attacks from one. It implements digital signature standards finalized by the U.S. National Institute of Standards and Technology (NIST), specifically FIPS 204, which is based on a module-lattice-based algorithm designed to be computationally difficult for both classical and quantum computers to break. By integrating PQC operations directly into the hardware, the S3SSE2A can perform these complex calculations approximately 17 times faster than a software-only solution, providing robust security without compromising performance.  

Samsung is actively commercializing this technology, integrating PQC into its flagship Samsung Knox security platform and introducing it to consumers with the Galaxy S25 series. This move effectively monetizes the anticipation of quantum computing. By positioning itself as a leader in quantum-safe security, Samsung turns a future technological threat into a current revenue opportunity and a powerful marketing differentiator for its premium devices, establishing a strong market position long before the threat fully materializes.  

2.2 Consumer-Facing Enablement: The “Galaxy Quantum” Series

Samsung has also explored the consumer market’s appetite for quantum-branded technology through its “Galaxy Quantum” smartphone series. Launched exclusively in South Korea in partnership with the carrier SK Telecom, devices like the Galaxy Quantum 5 are presented as “quantum-powered”.  

However, the technology at the heart of these phones is not a quantum processor. Instead, it is a Quantum Random Number Generator (QRNG) chip, developed by the Swiss company ID Quantique. This tiny chip leverages quantum phenomena to generate truly unpredictable random numbers, which are used to create more secure encryption keys for sensitive applications like mobile payments and authentication. While technically interesting, many analysts view the “quantum” branding as a marketing strategy to differentiate the product in a highly competitive market, rather than a revolutionary leap in computing.  

The strategic value of this initiative lies in its function as a controlled market experiment. By limiting the launch to the tech-savvy South Korean market, Samsung can use the country as a “petri dish” to gauge consumer interest in quantum security features, test the technology’s real-world viability, and build brand association with the “quantum” concept, all without the financial risk and logistical complexity of a global product launch. It is a low-risk, high-visibility exercise in market research and brand positioning.  

2.3 Strategic Investment and Foundational Research

Samsung’s most direct engagement with the development of quantum computing itself comes through strategic investments and academic partnerships. This approach allows the company to gain a foothold in the nascent industry, monitor its progress, and build essential expertise without committing massive capital to a single, unproven fabrication technology.

  • Venture Investment: Through its evergreen venture capital arm, the Samsung Catalyst Fund, Samsung co-led a $55 million funding round for IonQ, a leading American quantum computing company that specializes in building trapped-ion quantum computers. At the time of the investment, Samsung’s Chief Strategy Officer, Young Sohn, described quantum computing as a “foundational and revolutionary” technology, signaling the company’s long-term strategic interest in unlocking its potential for fields like AI and materials science.  
  • Application-Focused Research: Samsung has also acted as a potential end-user of quantum computing to explore its practical applications. The company partnered with Honeywell Quantum Solutions (now part of Quantinuum) and researchers at Imperial College London to use Honeywell’s System Model H1 trapped-ion quantum computer. The project involved running complex simulations of interacting spin models to research the development of better, longer-lasting batteries for mobile devices.  
  • Academic Collaboration: To foster foundational knowledge and cultivate future talent, Samsung Semiconductor India Research (SSIR) has collaborated with the prestigious Indian Institute of Science (IISc) to establish a dedicated Quantum Technology Lab. This lab will focus on core research challenges, such as integrating cryogenic control chips with qubits and developing single photon sources and detectors, while also serving as a vital training ground for the next generation of quantum scientists and engineers.  

This pattern of activity—investing in a leading hardware startup, using a competitor’s system for application research, and funding a university lab—provides a definitive answer to the user’s query. Samsung is strategically positioning itself on the quantum frontier, but it is doing so as an investor, a potential customer, and a research sponsor. This allows it to learn from and influence the ecosystem’s development while letting smaller, more agile players like IonQ bear the immense risk of pioneering a dominant qubit fabrication technology. It is a patient, long-term strategy designed to build the intellectual and human capital necessary to enter the fabrication market decisively if and when a winning technological path becomes clear.

The Alliance Matrix: Deconstructing Samsung’s Key Technology Partnerships

In the hyper-competitive and capital-intensive semiconductor industry, strategic alliances are not merely beneficial; they are essential for survival and growth. Samsung Electronics navigates a complex web of partnerships, acting as a supplier, a customer, a competitor, and a collaborator—often with the same company. An analysis of its relationships with NVIDIA, AMD, Apple, and Intel reveals a dynamic landscape where alliances are forged out of mutual necessity to either dominate a market, challenge an incumbent, or survive the threat of a common, larger rival.

3.1 NVIDIA: The Symbiotic AI Powerhouse

The relationship with NVIDIA is defined by a critical supplier-client dynamic at the heart of the artificial intelligence boom. NVIDIA is the undisputed leader in AI accelerators, and securing a position in its supply chain is a paramount objective for any memory manufacturer.

After a protracted and challenging qualification process, Samsung has successfully entered NVIDIA’s supply chain for its most advanced products. The company is now set to supply its fifth-generation, 12-layer HBM3E (High-Bandwidth Memory) chips for NVIDIA’s next-generation GB300 AI accelerator. This breakthrough, reportedly confirmed in a personal communication from NVIDIA CEO Jensen Huang to Samsung Chairman Lee Jae-yong, marks a major strategic victory for Samsung. For years, this lucrative high-margin market was dominated by Samsung’s crosstown rival, SK hynix, and Samsung’s previous attempts to qualify its HBM products had faced setbacks.  

This deal is more than a simple supply contract. For Samsung, it is a crucial validation of its memory technology at the highest level, restoring both revenue and “pride” after falling behind in the HBM race. For NVIDIA, adding Samsung as a qualified HBM supplier is a vital strategic move. It diversifies its supply chain, reducing its dependence on a single source (SK hynix) and introducing significant competitive pressure on pricing and capacity in the HBM market, which benefits all AI hardware makers and their hyperscaler customers.  

The collaboration extends beyond memory into emerging technologies. Samsung and NVIDIA are also working together to advance AI-RAN (Radio Access Networks), integrating Samsung’s virtualized RAN (vRAN) software with NVIDIA’s accelerated computing platforms (CPUs and GPUs) to bring AI-driven efficiencies to mobile networks. This demonstrates a partnership that is both tactical in the present (HBM supply) and strategic for the future (co-development in next-generation networking).  

3.2 AMD: The Challenger Alliance

While the NVIDIA partnership is about supplying the incumbent leader, Samsung’s relationship with AMD is about building a powerful challenger ecosystem. This alliance is arguably deeper, more integrated, and more strategically co-dependent than any of Samsung’s other partnerships.

Samsung is positioned as the primary memory supplier for AMD’s AI ambitions. Building on an existing relationship where Samsung provides HBM3E for AMD’s current MI350 series accelerators, the company is set to be the main supplier of next-generation HBM4 for AMD’s upcoming MI450 chips. This partnership has been supercharged by a massive, multi-billion dollar deal between AMD and OpenAI, which will see OpenAI deploy AMD’s accelerators in its next-generation AI infrastructure. This provides a demand signal of sufficient scale to anchor the AMD-Samsung alliance.  

The collaboration is uniquely broad, extending across Samsung’s entire semiconductor portfolio:

  • Memory: Samsung is the key HBM partner for AMD’s flagship AI accelerators.  
  • Foundry: While not explicitly detailed for the MI450, Samsung’s foundry is a major competitor for AMD’s 5nm and 3nm chip orders, and AMD has used Samsung’s 4nm process for other products.  
  • IP Licensing: In a multi-year strategic agreement, Samsung licenses AMD’s high-performance, low-power RDNA graphics IP for integration into its own Exynos system-on-chips (SoCs) for mobile devices.  
  • Networking: The two companies are also collaborating on 5G vRAN solutions, pairing Samsung’s software with AMD’s EPYC processors to deliver high-capacity, energy-efficient networks.  

This deep integration across memory, logic, and IP creates a full-stack strategic counterweight to the dominant NVIDIA-TSMC-SK hynix axis. It is an alliance born of mutual necessity. AMD requires Samsung’s cutting-edge memory and its high-volume foundry capacity to mount a credible challenge to NVIDIA’s market dominance. In turn, Samsung needs a high-volume, leading-edge customer like AMD to legitimize its foundry and HBM businesses as viable top-tier alternatives to TSMC and SK hynix. The landmark OpenAI deal provides the commercial catalyst to solidify this challenger ecosystem, giving hyperscale customers a powerful second-sourcing option for their AI buildouts.

3.3 Apple: The Strategic Supplier-Client Dynamic

The relationship between Samsung and Apple is one of the most complex in the technology industry, characterized by fierce competition in consumer markets and deep co-dependence in the component supply chain. Their latest partnership in U.S.-based chip manufacturing highlights this “frenemy” dynamic.

As previously noted, Apple has partnered with Samsung to produce next-generation CMOS Image Sensors (CIS) at Samsung’s fab in Austin, Texas. This collaboration is centered on an innovative 3-stack hybrid bonding technology that has reportedly “never been used before,” aiming to significantly enhance the camera performance of future iPhones, starting with the iPhone 18.  

This partnership serves critical strategic goals for both companies. For Apple, it achieves two key objectives: first, it reduces its reliance on Sony, its long-time primary supplier for camera sensors, thereby de-risking its supply chain and increasing its negotiating leverage. Second, by locating this advanced manufacturing in the U.S., it aligns with Apple’s public commitment to invest in American manufacturing and mitigates geopolitical and tariff-related risks. For Samsung, the deal is a major coup. It secures a high-volume, high-margin contract from the world’s most demanding technology customer, providing a powerful external validation of its advanced manufacturing and packaging capabilities in a domain beyond its traditional strengths in memory and logic.  

3.4 Intel: The Coopetition Imperative

Perhaps the most strategically intriguing development is the potential for an alliance between Samsung and Intel—two direct and fierce competitors in the foundry market. This exploration of “coopetition” is born from a shared necessity: the need to challenge the overwhelming market dominance of Taiwan Semiconductor Manufacturing Company (TSMC).

Reports indicate that Samsung and Intel are exploring a strategic foundry alliance focused on areas of complementary strength, specifically advanced packaging and next-generation glass substrate technology. While Samsung is widely recognized as being ahead of Intel in leading-edge front-end wafer fabrication (i.e., transistor technology like its 3nm Gate-All-Around process), Intel holds a competitive advantage in certain back-end packaging technologies, such as hybrid bonding and its decade-long research into glass substrates. To this end, Samsung has already hired a senior engineer with extensive experience in glass substrates from Intel to bolster its own R&D efforts.  

Such a partnership would allow the two companies to offer a more complete and competitive alternative to TSMC, which currently leads the industry in both advanced wafer fabrication and integrated packaging solutions. By combining Samsung’s front-end process leadership with Intel’s back-end packaging expertise, they could present a compelling, integrated “not-TSMC” value proposition to the world’s largest fabless chip designers. This potential alliance is a clear signal that TSMC’s market power has grown so immense that it is forcing its two largest rivals to consider collaborating to survive and compete effectively. It is a defensive strategy driven by the recognition that the threat from a single dominant market leader is greater than the threat they pose to each other in these specific technological domains.  

Section 4: Synthesis and Strategic Outlook: Identifying Samsung’s Most Critical Partner

The analysis of Samsung’s individual partnerships reveals a complex tapestry of strategic imperatives. NVIDIA represents immediate, high-volume revenue from the market incumbent. AMD is a deep, co-dependent partner in a challenger ecosystem. Apple is a demanding, high-value client driving innovation in niche technologies. Intel is a potential “coopetitor” in a defensive alliance against a common rival. To determine which of these relationships is most critical, however, one must look beyond the partners themselves to the underlying force driving the entire industry: the insatiable demand for AI compute. This reveals that Samsung’s most important future collaborator may not be a traditional chip designer, but a new class of entity altogether—the AI Hyperscaler.

4.1 The Battle for AI Supremacy: NVIDIA vs. AMD

In the current market, the partnerships with NVIDIA and AMD are paramount, as they are the primary conduits to the booming AI accelerator market. The NVIDIA relationship is a tactical necessity. As the AI market leader with an estimated 80-95% market share, being a qualified supplier to NVIDIA is essential for capturing immediate, large-scale revenue in the HBM market. The recent HBM3E deal is a critical win that puts Samsung back in the game at the highest level.  

The AMD partnership, however, is arguably more strategic in the long term. It is not just about supplying components; it is about co-creating a competitive alternative to prevent the AI market from becoming a permanent NVIDIA monopoly. A strong AMD, powered by Samsung’s memory and foundry, gives customers a viable second source, which in turn gives Samsung greater market influence and pricing power than it would have as just one of several suppliers competing for NVIDIA’s business. The depth of the AMD alliance, spanning memory, foundry, IP, and networking, underscores its nature as a foundational, ecosystem-building endeavor.  

4.2 The “Someone Else” Factor: The Rise of the AI Hyperscaler

The traditional semiconductor value chain—where a fabless designer like NVIDIA or AMD dictates terms to a foundry/memory supplier like Samsung—is being fundamentally disrupted. A new center of gravity has emerged in the form of AI Hyperscalers, whose colossal demand for computing power is now the primary force shaping the entire industry. The most prominent example of this new dynamic is OpenAI.

OpenAI has become a central node in Samsung’s strategic calculus, forging direct, massive-scale partnerships that transcend traditional supplier relationships. OpenAI’s landmark agreement with AMD to deploy its MI450 accelerators is the direct catalyst for Samsung’s HBM4 supply deal. More significantly, Samsung has forged a direct, multi-divisional strategic partnership with OpenAI to support its “Stargate” initiative—a global project to build a network of next-generation, hyperscale AI data centers.  

Under this agreement, Samsung Electronics will act as a “strategic memory partner” to OpenAI, working to supply a projected demand that could reach a staggering 900,000 DRAM wafers per month. The partnership extends across the Samsung conglomerate, with Samsung SDS collaborating on data center design and operation, and Samsung C&T and Samsung Heavy Industries exploring the joint development of innovative floating data centers.  

This direct alignment provides the ultimate answer to the user’s question. The entity Samsung will work with most closely and that will have the most profound impact on its strategic direction is the AI Hyperscaler, with OpenAI being the current archetype. The market-defining demand from entities like OpenAI is the upstream force that determines which AI accelerators are purchased, which in turn drives Samsung’s HBM and foundry production priorities. By partnering directly with the ultimate source of this demand, Samsung is positioning itself not just as a component maker for the tool builders (NVIDIA and AMD) but as a foundational infrastructure partner for the entities creating the AI-driven future.

While NVIDIA is its largest source of AI-related revenue today, and AMD is its most integrated ecosystem partner, OpenAI represents the most powerful strategic demand driver that will shape the future of Samsung’s semiconductor business.

Table 2: Comparative Analysis of Samsung’s Strategic Partnerships

PartnerPartnership TypeKey Technologies InvolvedStrategic ImportanceFuture Outlook
NVIDIASupplier-ClientHBM3E Memory, AI-RANImmediate Revenue: Access to the dominant AI accelerator market leader. Stable High Volume: Crucial for near-term revenue, but Samsung is one of several suppliers competing for allocation.
AMDStrategic AllianceHBM3E/HBM4 Memory, Foundry Services, RDNA Graphics IP, vRAN Ecosystem Building: Co-creating a full-stack challenger to the market leader, increasing Samsung’s long-term market power.High Growth Challenger: Success is tied to AMD’s ability to capture market share from NVIDIA; high potential upside.
AppleStrategic SupplierAdvanced CMOS Image Sensors (CIS), 3-Stack Hybrid Bonding Supply Chain Security & Niche Innovation: Secures a high-value contract, diversifies Apple’s supply chain, and validates Samsung’s advanced packaging tech.Niche Innovation: A highly valuable but technologically focused partnership, unlikely to define Samsung’s overall strategy.
IntelCoopetition (Exploratory)Advanced Packaging, Glass Substrates Market Disruption: A defensive alliance of rivals aimed at creating a viable alternative to the dominant foundry, TSMC.Speculative: High potential to realign the industry if it materializes, but currently remains a potential collaboration.
OpenAIStrategic Demand DriverAI Infrastructure, HBM/DRAM at Hyperscale, Data Center Design Market Defining: The ultimate source of demand that drives the entire AI hardware ecosystem, including orders for NVIDIA and AMD chips.Market Defining: This partnership aligns Samsung with the primary force shaping future semiconductor demand, making it the most critical long-term relationship.

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